In summary:
- Macworld examines a theory suggesting Apple may consolidate M5 Pro and M5 Max chips using 2.5D packaging technology, with OS 26.3 code notably omitting M5 Pro references.
- This unified design approach could allow Apple to use a single logic board while offering different core counts and RAM configurations between the two chip variants.
- The proposed changes may eliminate Ultrafusion technology in favor of monolithic M5 Ultra dies, potentially reducing manufacturing costs and simplifying Apple’s silicon production process.
On Wednesday, Apple released the OS 26.3 Release Candidates to developers, and not long afterwards, mentions of the M5 Max and M5 Ultra were found hiding in the code. However, references to the M5 Max Pro have yet to be reported, which has us wondering about the status of the chip. Is it the nature of beta software, and the M5 Pro will be put in later? Was it an error? Or is Apple dropping the M5 Pro chip from the lineup?
Vadim Yuryev of Max Tech on YouTube has a theory that actually makes a lot of sense. Yuryev posits that Apple is now using 2.5D chip packaging, which would allow for a single chip design for the M5 Pro and the M5 Max. Thus, if the two chips are based on the same design, there’s no need for two separate references in the OS code. An M5 Pro is basically an M5 Max, but with fewer CPU cores, fewer GPU cores, and a lower upper limit of RAM supported.
With previous M-series chips, the Pro and Max versions required different designs. However, reports have said that Apple is working with TSMC to implement a SoIC-mH process for the M5 Pro/Max. This process is different from 2.5D, which TSMC also offers. Wccftech thinks that the two processes are being combined to help lower costs. The 2.5D process is one used by other chip manufacturers, such as AMD and Nvidia.
Yuryev also muses that the new architecture would “allow the M5 Ultra to be built as a monolithic die with multiple chiplets,” eliminating the need for ultrafusion, which essentially acted as a bridge between two M5 Max chips.
Whatever process Apple and TSMC are using, Apple now needs to make only one logic board design. That’s a cost savings for Apple, and considering that Apple is having supply chain challenges, it could only help when it comes to determining prices that customers will have to shell out.
Apple is expected to launch the new M5 MacBook Pros soon, possibly before the end of February.
Author: Roman Loyola, Senior Editor, Macworld
Roman is a Macworld Senior Editor with over 30 years of experience covering the tech industry, focusing on the Mac and other products in the Apple ecosystem. He is also the host of the Macworld Podcast. His career started at MacUser, where he received Apple certification as a repair technician (when Apple did that kind of thing). He's also worked for MacAddict, MacLife, and TechTV.